Our surface mount technology utilizes high-speed Fuji NXT feeders and Mycronic MY500 systems for precision placement of 01005 chips to large BGAs. Nitrogen reflow ovens with closed-loop thermal profiling ensure voiding rates below 15%, while 3D SPI machines verify solder paste volume pre-reflow. This automated process guarantees exceptional repeatability for high-density designs in medical wearables, IoT modules, and communication devices where component miniaturization is critical.
