| Brand Name: | DuxPCB |
| Model Number: | Automotive PCBA |
| MOQ: | 1 pcs |
| Price: | Negotiable (depends on BOM) |
| Delivery Time: | 3–5 days for prototype, 7–10 days for mass production |
| Payment Terms: | MoneyGram,Western Union,T/T,D/P,D/A,L/C |
DuxPCB provides automotive-grade PCB Assembly services where failure is not an option. From internal combustion engine control units (ECU) to modern Electric Vehicle (EV) Battery Management Systems (BMS) and ADAS radars, we deliver the reliability required for the road.
The automotive industry is undergoing a seismic shift towards electrification and autonomy. This demands electronics that can withstand higher voltages, extreme thermal cycling, and continuous vibration. DuxPCB bridges the gap between design innovation and manufacturing reality, strictly adhering to IATF 16949:2016 quality management systems to ensure Zero-Defect delivery.
Automotive electronics manufacturing differs fundamentally from consumer electronics. It requires a "Zero Defect" mindset and rigorous documentation.
In the automotive sector, knowing "what, when, and who" is critical for liability and recall management. DuxPCB utilizes an advanced Manufacturing Execution System (MES).
Component Level: We trace every capacitor and IC back to its manufacturer lot number and date code.
Process Level: Every board records which machine assembled it, the reflow oven temperature profile used, and the operator who performed the final inspection.
Data Retention: Production records are archived for 10+ years to meet OEM audit requirements.
We speak the language of Tier 1 suppliers. We provide full Production Part Approval Process (PPAP) documentation (Level 1 to Level 5) and engage in Advanced Product Quality Planning (APQP) from the prototype stage.
PFMEA (Process Failure Mode & Effects Analysis): We analyze potential assembly risks before production begins and implement engineering controls to prevent them.
Control Plans: Defining strictly monitored parameters at every production step.
For critical safety systems (Airbags, Braking, Steering), "good enough" is unacceptable. We manufacture to IPC-A-610 Class 3 standards, ensuring superior solder joint reliability, barrel fill, and cleanliness compared to standard consumer electronics.
Modern vehicles are data centers on wheels. Our facility is equipped to handle the complex technologies found in next-generation cars.
| Capability Category | Specification & Technology |
|---|---|
| Certifications | IATF 16949:2016, ISO 9001:2015, UL Certified (E-File Available) |
| Component Sourcing | Only AEC-Q100 / AEC-Q200 certified components from authorized channels |
| Substrate Types | High-Tg FR4, Metal Core (IMS) for LED/Power, Ceramic for Radar, Heavy Copper (up to 12oz) |
| Mounting Tech | SMT (0201 chips), Press-Fit (High reliability connectors), Through-Hole |
| Cleanliness | Ionic Contamination Testing per IPC standards; Technical Cleanliness (VDA 19.1 compliant process) |
| Coating & Potting | Automated Selective Conformal Coating; Silicone Potting for IP67/IP68 sealing |
| Testing | AOI, 3D X-Ray, ICT, FCT, Thermal Shock, Vibration Testing |
| Solder Validation | Void analysis for BGA and QFN thermal pads (Target < 15% voiding) |
We support clients across the entire mobility spectrum, from traditional ICE to EV/HEV and Autonomous Driving.
High voltage and high current demand robust thermal management.
BMS (Battery Management Systems): Assembly of heavy copper boards for cell monitoring and balancing.
OBC (On-Board Chargers) & Inverters: Handling high-power modules and aluminum-backed PCBs (MCPCB) for efficient heat dissipation.
Safety relies on signal integrity and precision.
Radar & LiDAR: Processing High-Frequency RF laminates (Rogers/Taconic) with tight impedance control for 24GHz/77GHz sensors.
Camera Modules: High-density interconnect (HDI) assembly for image processing units.
Reliability for comfort and control systems.
ECU (Electronic Control Units): Engine control, Transmission control, and Gateway modules.
Lighting: LED Matrix drivers requiring metal-core assembly and stringent color binning management.
HMI: Dashboard displays and capacitive touch interfaces.
DuxPCB implements specific testing protocols designed to stress-test boards against automotive environments.
1. Thermal Shock & Cycling
Vehicles experience rapid temperature changes (e.g., winter startup vs. engine heat). We perform thermal cycling tests (-40°C to +125°C) to verify that solder joints do not crack due to CTE (Coefficient of Thermal Expansion) mismatch.
2. Vibration Testing
For boards mounted on engines or wheels, vibration is constant. We apply staking compounds (epoxy) to large components and perform random vibration testing to ensure mechanical integrity.
3. Press-Fit Technology
Automotive connectors often avoid soldering to eliminate thermal stress. We utilize automated Press-Fit machines with Force-Displacement Monitoring to ensure every pin is seated correctly without damaging the PCB plated through-hole.
4. 3D Solder Paste Inspection (SPI)
70% of defects stem from poor paste printing. Our 3D SPI machines measure the volume and height of solder paste on every pad, rejecting insufficient deposits before the component is even placed.
The automotive supply chain is notoriously fragile. DuxPCB protects your production line.
AEC-Q Compliance: We strictly source components that meet AEC-Q100 (IC) and AEC-Q200 (Passive) standards unless otherwise specified.
PCN Management: We monitor Product Change Notifications (PCN) from component manufacturers. If a chip is changing form or function, we alert you months in advance.
Authorized Channels: To prevent counterfeit risks, we procure strictly from authorized distributors (Arrow, Avnet, Future) and enforce a zero-substitution policy without written Engineering Change Order (ECO) approval.
Q: Can you support PPAP Level 3 documentation?
A: Yes. We have a dedicated Quality Engineering team that prepares the full PPAP package, including Process Flow Diagrams, PFMEA, Control Plans, and Dimensional Reports for your validation.
Q: How do you handle soldering voids in power modules?
A: For high-power QFNs and IGBTs used in EVs, we optimize the reflow profile (using vacuum reflow if necessary) to minimize voids. We verify this with 100% X-Ray inspection, targeting a void percentage below industry standards (typically <15-20%).
Q: Do you offer conformal coating for harsh environments?
A: Yes. We use automated selective coating machines to apply Acrylic, Silicone, or Polyurethane coatings. This protects the PCBA from moisture, road salt spray, and chemical fumes, essential for under-hood applications.
Q: What is your traceability capability in case of a recall?
A: Our MES system links every unique PCBA Serial Number to the specific component lots used. In the event of a component manufacturer recall, we can instantly identify exactly which boards contain the affected batch and where they were shipped.
In the automotive industry, reputation is built on reliability. Don't risk your brand with generalist assemblers. Choose a partner who understands the rigors of the road.
Send your RFQ and Quality Requirements to DuxPCB. Our automotive program managers will conduct a comprehensive review of your design and provide a detailed manufacturing proposal.