Factory Tour

Our factory floor is designed according to Lean Manufacturing principles and operates under ESD S20.20 static control standards. We utilize a fully digitized Manufacturing Execution System (MES), ensuring that every board, component, and process step is tracked in real-time.

SMT Workshop (Surface Mount Technology)

Our 5 high-speed SMT lines are the heart of our assembly capability.

• Paste Printing: GKG Fully Automatic Printers with 3D SPI (Solder Paste Inspection) to ensure perfect paste volume before component placement.

• Placement: Equipped with Yamaha YSM Series and Fuji mounters, capable of placing 01005 passives, 0.25mm pitch BGAs, and POP (Package-on-Package) components.

• Reflow: Heller 10-Zone Nitrogen (N2) Reflow Ovens. The nitrogen atmosphere minimizes oxidation, significantly reducing voiding in BGA and QFN thermal pads (target <15%).

• Inspection: 100% Inline AOI (Automated Optical Inspection) and X-Ray verification for all hidden solder joints.

DIP & Soldering Workshop

For high-reliability and power components, we blend automation with skilled craftsmanship.

• Auto-Insertion: Universal Axial/Radial insertion machines for high-volume passive components.

• Wave Soldering: Dual-wave machines for mixed-technology boards.

• Selective Soldering: Robotic soldering stations for high-density boards where wave soldering is impossible. This ensures precise barrel fill without thermal shock to adjacent SMT parts.

Box Build & Testing Floor

• Clean Room Assembly: Class 10,000 clean room for assembling sensitive medical and optical devices.

• Testing: Dedicated stations for ICT (In-Circuit Test), FCT (Functional Test), and Hi-Pot safety testing.

• Aging/Burn-In: Temperature-controlled aging rooms to screen out early-life component failures before shipment.