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| Brand Name: | DUXPCB |
| Model Number: | High-Frequency PCB |
| MOQ: | 1 pcs |
| Price: | Negotiable / Based on layer and complexity |
| Delivery Time: | 3–5 days for prototype, 7–10 days for mass production |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
DuxPCB specializes in the fabrication of High Frequency (RF) and Microwave PCBs. As signal speeds increase and wavelengths decrease, the PCB material becomes a critical component of the circuit design. We provide the manufacturing precision required to maintain signal integrity, minimize insertion loss, and ensure consistent dielectric performance.
From low-loss 5G base station antennas to automotive millimeter-wave radar (77GHz), DuxPCB partners with industry-leading material suppliers to deliver boards that perform exactly as simulated.
RF materials (like PTFE) are expensive and mechanically soft. DuxPCB excels in Hybrid Multilayer Construction, where we combine high-frequency laminates (e.g., Rogers) with standard FR4 cores in the same stack-up.
Cost Efficiency: Using expensive RF material only on the signal layers where it is needed.
Mechanical Strength: Using FR4 to provide rigidity and simplify the assembly process.
Process Control: We have mastered the lamination cycles required to bond dissimilar materials without delamination or warping.
RF PCBs require tighter tolerances than standard digital boards. Our facility is equipped to handle sensitive PTFE and ceramic-filled materials.
| Capability Item | Specification Range |
|---|---|
| Frequency Range | 500 MHz to 80 GHz+ |
| Layer Count | 2 - 30 Layers (Pure RF or Hybrid) |
| Material Partners | Rogers, Taconic, Isola, Arlon, Panasonic (Megtron), Wangling |
| Dielectric Constant (Dk) | 2.20 - 10.20 (Tolerance +/- 0.05) |
| Dissipation Factor (Df) | As low as 0.0009 |
| Trace Width Tolerance | +/- 0.015mm (+/- 0.6mil) |
| Impedance Control | +/- 5% |
| Surface Finishes | Immersion Silver (Preferred for RF), ENIG, ENEPIG, OSP |
| Special Processes | Cavity Routing (Stepped Groove), Back Drilling, Metal Backed (Bonding) |
| Via Protection | Conductive / Non-conductive Epoxy Fill, Copper Paste (VIPPO) |
Choosing the right substrate is 90% of the battle in RF PCB manufacturing. DuxPCB holds stock of common high-frequency laminates to shorten lead times.
Examples: Rogers RT/duroid series, Taconic TLY.
Characteristics: Lowest possible Dielectric Loss (Df). Ideal for high-power amplifiers and radar.
Challenge: Mechanically soft; requires specialized drilling parameters and plasma etching for via plating.
Examples: Rogers RO4000 series (RO4350B, RO4003C).
Characteristics: Processes similar to FR4 but with significantly better electrical performance.
Usage: The industry standard for commercial RF and microwave applications.
Examples: Panasonic Megtron 6, Isola Tachyon.
Usage: High-speed digital servers and networking equipment requiring low loss at high data rates.
RF boards are unforgiving. A slight variation in trace width or copper roughness can detune a filter or ruin an antenna's efficiency.
At high frequencies, the "Skin Effect" forces current to flow on the outer surface of the conductor. We utilize precision vacuum etching lines to maintain a strictly rectangular trace profile (minimizing the trapezoidal effect), ensuring your impedance matches the design calculation.
We select Very Low Profile (VLP) or HVLP copper foils to minimize conductor loss. Furthermore, we recommend suitable surface finishes—like Immersion Silver—that offer lower electrical resistance compared to Nickel-based finishes (ENIG) for critical RF signals.
When drilling PTFE materials, resin smear can block electrical connection. DuxPCB uses advanced Plasma treatment to clean the hole walls before plating, guaranteeing reliable via interconnects.
Our High Frequency PCBs are driving innovation in:
Telecommunications: Power Amplifiers, Base Station Antennas, Filters, Combiners.
Automotive: 24GHz / 77GHz Radar sensors (ADAS), V2X Communication.
Aerospace: Satellite navigation (GPS/GNSS), Military guidance systems.
IoT: Long-range wireless modules (LoRa, NB-IoT).
We verify the electrical performance using advanced metrology.
TDR Impedance Testing: Verifying characteristic impedance.
PIM Testing (Passive Intermodulation): For antenna boards, ensuring low noise performance.
Micro-sectioning: Verifying the integrity of the bond between different material types in hybrid stack-ups.
Don't let material availability or manufacturing tolerances delay your launch.
Send your Gerber files and Material Specifications to DuxPCB. Our RF engineering team will review your stack-up, confirm material stock status, and provide a competitive quote within 24 hours.
