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| Brand Name: | DUXPCB |
| Model Number: | Halogen-Free PCB |
| MOQ: | 1 pcs |
| Price: | 3–5 days for prototype, 7–10 days for mass production |
| Delivery Time: | 3–5 days for prototype, 7–10 days for mass production |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
Halogen Free PCB Manufacturing | 1-40 Layers High-TG Materials | Aerospace & AI Computing | DuxPCB
In the evolving landscape of Advanced PCBA Solutions, Halogen-Free PCBs have transitioned from an environmental compliance requirement to a performance-critical benchmark for Military-Grade Reliability. At DuxPCB, our halogen-free substrates strictly adhere to IEC 61249-2-21 standards, maintaining chlorine and bromine levels below 900ppm. By utilizing advanced phosphorus and nitrogen-based flame retardants, we achieve superior Thermal Management and a higher glass transition temperature (Tg) compared to traditional FR-4. This makes our boards ideal for High-Density Interconnect (HDI) designs where thermal stability and Controlled Impedance are paramount for next-generation AI and aerospace electronics.
| Category | Material / Capability |
|---|---|
| Flame Retardants | Phosphorus, Nitrogen, Phosphorus & Nitrogen Compounds, Aluminum Hydroxide, Magnesium Hydroxide, Ceramics |
| Resins | Benzoxazine Resins, Bismaleimide Triazine (BT), Tetrafunctional Epoxy Resins, Bisphenol Epoxy Vinyl Esters, Cyanate Esters, Polyimide |
| Brand & Model: Rogers | RO4835™, RO4360G2™ |
| Brand & Model: ITEQ / KB | IT-180A, KF Series (KF-611, KF-615) |
| Brand & Model: Shengyi | S1000H, S1165, S1155 Series |
| Brand & Model: Dupont / Others | Pyralux® TK Series, Kapton, Panasonic, Isola, Park/Nelco (Halogen-free prepregs) |
| Quality Grade | Standard IPC 2, IPC-6012 Class 3 |
| Number of Layers | 1 - 40 layers (Specialized up to 60+) |
| Order Quantity | 1pc - 10000+pcs |
| Build Time | 2 days - 4 weeks |
| Board Size | Min 6*6mm | Max 457*610mm |
| Board Thickness | 0.4mm - 6.5mm |
| Copper Weight | 0.5oz - 3.0oz (Heavy Copper available) |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Color | White, Black, Yellow |
| Surface Finish | HASL, Lead Free HASL, ENIG, Immersion Silver, Immersion Tin, OSP |
| Min Annular Ring | 4mil |
| Min Drill Diameter | 6mil (Laser Microvias available) |
| Other Techniques | Gold fingers, Blind/Buried Vias, Controlled Impedance |
1. Resolving Complex Yield Bottlenecks: Many manufacturers struggle with the mechanical brittleness of halogen-free laminates in High-Layer Count designs. DuxPCB utilizes proprietary drilling and lamination cycles to ensure 100% yield on 40+ layer boards where others fail.
2. Precision Impedance for AI & RF: While standard boards fluctuate in dielectric constant, we guarantee Controlled Impedance precision within +/-5% for ultra-high-speed signal paths, critical for AI computing and RF modules.
3. Advanced Material Mastery: We maintain a deep stock of specialized materials like Rogers and Megtron, ensuring that your Military-Grade Reliability requirements are met with authentic, high-performance substrates that withstand harsh environments.
4. Engineering-First DFM Support: We don't just manufacture; we optimize. Our senior engineers provide comprehensive Design for Manufacturing (DFM) reviews to identify potential signal integrity or thermal issues before the first prototype is ever built.
How does Halogen-Free material affect thermal expansion? Halogen-free laminates typically exhibit a lower Z-axis Coefficient of Thermal Expansion (CTE), which significantly improves the reliability of plated through-holes (PTH) during repeated thermal cycling.
Are these boards compatible with lead-free soldering? Yes, the higher Tg (Glass Transition Temperature) and Td (Decomposition Temperature) of our halogen-free materials make them exceptionally robust for the high-temperature requirements of lead-free reflow processes.
Can you produce Any-Layer HDI with Halogen-Free resins? Absolutely. DuxPCB specializes in Any-Layer HDI using Laser Microvias, allowing for the highest possible component density in eco-friendly mobile and wearable technology.
What is the typical lead time for a high-difficulty prototype? For complex designs involving blind/buried vias and high-layer counts, our standard turn-around is 2-3 weeks, with 5-day expedited options available for urgent engineering validation.
Secure the future of your high-performance hardware by leveraging the technical expertise of DuxPCB. Whether you are scaling an AI infrastructure or deploying critical aerospace systems, our halogen-free manufacturing processes deliver the precision and environmental stewardship your project demands. Upload your Gerber files today for a comprehensive technical review and bridge the gap between complex design and flawless execution.
