Rigid Flex PCB Manufacturing Services 12-20 Layers HDI Class 3 PCBA Fabrication

DuxPCB delivers high-reliability Rigid-Flex Printed Circuits, combining the durability of rigid boards with the versatility of flexible circuits into a single, integrated unit. This technology eliminates the need for bulky connectors and fragile wire harnesses, providing the most reliable interconnect solution for limited-space applications.
From 4-layer consumer wearables to complex 20-layer aerospace avionics involving HDI technology, DuxPCB has the engineering expertise to manage the critical lamination processes and CTE (Coefficient of Thermal Expansion) mismatches inherent in rigid-flex manufacturing.

Rigid-Flex manufacturing requires precise alignment between the flexible core and the rigid layers. DuxPCB utilizes advanced Laser Direct Imaging (LDI) and Vacuum Lamination presses to achieve high yields.

Manufacturing Rigid-Flex is not simply gluing a flex board to a rigid board. It is a complex science of material compatibility.

For high-reliability applications, DuxPCB recommends using Adhesiveless Polyimide. Unlike traditional adhesive-based materials, adhesiveless laminates offer:

• Thinner Profile: Allowing for tighter bend radii.

• Better Thermal Performance: Eliminating the acrylic adhesive prevents Z-axis expansion failure during high-temp reflow or operation.

• Superior Plating: Improved reliability of plated through-holes (PTH) in the transition zone.

The point where the rigid section meets the flexible section is the "danger zone" for stress. DuxPCB employs specialized routing techniques and strain-relief designs (like epoxy beads or coverlay extensions) to prevent the copper traces from fracturing right at the interface.

We offer flexible solutions for surface finishing. We can apply Hard Gold to the edge fingers for repeated insertion cycles, while keeping ENIG on the SMT pads for reliable soldering, all on the same panel.

While the initial manufacturing cost of Rigid-Flex is higher than standard rigid boards, the Total Cost of Ownership is often lower due to assembly savings and reliability improvements.

• Weight & Space Reduction: Saves up to 60% of weight and space by removing connectors and cables.

• 3D Packaging: Allows the PCB to be folded and fitted into the device housing during assembly.

• Signal Integrity: Eliminates the impedance discontinuity and signal loss caused by connectors and solder joints.

• Reliability: "No connector" means "no loose connection" under vibration or shock.

Populating components on a Rigid-Flex board requires unique handling. DuxPCB provides full turnkey assembly services.

• Moisture Management: Polyimide absorbs moisture. We perform strictly controlled baking cycles (up to 4-8 hours) before assembly to prevent delamination.

• Custom Fixtures: We design magnetic pallets to keep the flexible areas flat during solder paste printing and reflow, ensuring precise component placement.

Rigid-Flex technology is the backbone of modern high-end electronics:

• Medical Devices: Hearing aids, Endoscopes, Implantable devices.

• Aerospace & Defense: Missile guidance systems, Cockpit displays, Satellite sensors.

• Automotive: Camera modules, Radar sensors, Gearbox controls.

• High-End Consumer: DSLR Cameras, Foldable Smartphones, VR Headsets.

We test Rigid-Flex boards to the limit to ensure they survive in the field.

• Thermal Shock Testing: Verifying the via integrity withstands rapid temperature changes.

• Peel Strength Test: Ensuring the bond between FR4 and Polyimide is solid.

• Micro-section Analysis: Checking the registration and plating quality of internal blind/buried vias.

• Flying Probe Testing: 100% electrical continuity check.

Rigid-Flex design rules are complex. Don't wait until the CAM stage to find errors.
Engage with DuxPCB early. Send your preliminary stack-up or Gerber files for a comprehensive DFM (Design for Manufacturing) review. We will help you optimize the layer structure for cost and yield.