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| Brand Name: | DUXPCB |
| Model Number: | High TG PCB |
| MOQ: | 1 pcs |
| Price: | 3–5 days for prototype, 7–10 days for mass production |
| Delivery Time: | 3–5 days for prototype, 7–10 days for mass production |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
In the realm of Precision manufacturing, High TG (Glass Transition Temperature) PCBs are essential for electronics subjected to extreme thermal loads. DuxPCB provides Advanced PCBA solutions using substrates that maintain structural integrity above 170°C. By leveraging High-Density Interconnect (HDI) technology and High-layer count stackup strategies, we ensure that your Fine pitch BGA components and Controlled Impedance traces remain stable during lead-free soldering and high-power operation. Our commitment to IPC Class 3 reliability guarantees performance in the most demanding aerospace, medical, and industrial environments.
| Feature | Capability |
|---|---|
| Quality Grade | Standard IPC 2 (IPC Class 3 Available) |
| Number of Layers | 1 - 40 layers |
| Order Quantity | 1 pc - 10,000+ pcs |
| Build Time | 2 days - 5 weeks |
| Material | KB6167F, S1141 (FR4), S1000-2M (FR4), IT180, Rogers 4350B, and more |
| Board Size | Min 6mm x 6mm | Max 500mm x 1500mm |
| Board Thickness | 0.2mm - 8mm |
| Copper Weight (Finished) | 0.5oz - 20oz |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Color | White, Black, Yellow, etc. |
| Surface Finish | HASL, Lead Free HASL, ENIG, Immersion Silver, Immersion Tin, OSP |
| Min Annular Ring | 4mil |
| Min Drilling Hole Diameter | Machine Drill: 0.15mm | Laser Drill: 0.075mm |
| Other Techniques | Gold fingers, Blind/Buried Vias, Countersink Holes |
| Testing Methods | AOI, Flying Probe, In-Circuit, X-Ray Inspection, Functional Testing |
| Certifications | IATF 16949:2016, ISO 9001:2015, ISO 14001:2015, ISO 13485:2016, UL |
| Manufacturer | Model | Tg Value |
|---|---|---|
| Isola | 370HR | 200°C |
| Rogers | N4380-13RF | 200°C |
| Rogers | RO4350B | 280°C |
| Rogers | RO4003C | 280°C |
| SYTECH | S1141 (FR4) | 175°C |
| SYTECH | S1000-2M (FR4) | 180°C |
| SYTECH | S1150G | 155°C |
| SYTECH | S1170G | 180°C (DMA) |
| ITEQ | IT180 | 180°C |
| Kingboard | KB-6167F | 170°C |
1. Stop Losing Profits to Low-Yield High-Layer Designs: Complexity shouldn't mean compromise. We specialize in high-layer count boards where others struggle, ensuring high yield rates that protect your project margins.
2. Eliminate Failure Risks in Mission-Critical Systems: Whether for medical life-support or aerospace navigation, our IPC Class 3 reliability standards ensure your hardware never fails when it matters most.
3. Prevent Costly Re-Spins with Technical DFM Consulting: Don't wait until production to find a design flaw. Our engineers provide deep DFM analysis to optimize Precision manufacturing and avoid the expense of late-stage redesigns.
4. Rapidly Scale from Prototype to Mass Production: High-difficulty boards often stall at the transition phase. We bridge the gap with high-speed prototyping and seamless scaling to 10,000+ units without losing technical precision.
Q: Why is High TG material necessary for lead-free soldering?
A: Lead-free solder requires higher reflow temperatures. High TG materials prevent the resin from softening, protecting the High-Density Interconnect structures and vias from thermal damage.
Q: Can DuxPCB handle hybrid stackups with Rogers and FR4?
A: Yes. We frequently engineer hybrid High-layer count stackups that combine the cost-effectiveness of High TG FR4 with the RF performance of Rogers materials.
Q: What is the benefit of laser drilling for High TG boards?
A: Laser drilling allows for 0.075mm micro-vias, which are essential for Fine pitch BGA routing and maximizing circuit density in advanced electronics.
Secure your project's success today. Upload your Gerber files for a comprehensive technical review and quote from our engineering team.
