Multi-stage inspection protocols combine AOI, X-ray, and cross-section analysis to verify assembly quality. Our CyberOptics 3D AOI systems detect soldering defects at 10μm resolution, while X-ray inspection examines hidden connections under BGA and QFN components. Cross-sectional analysis of plated through-holes and microsections validates internal structure integrity, maintaining IPC Class 2/3 standards across medical, automotive, and military applications.
