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Created with Pixso. Aluminum PCB Manufacturers , Metal Core PCB Fabrication For Automotive / Industrial Lighting

Aluminum PCB Manufacturers , Metal Core PCB Fabrication For Automotive / Industrial Lighting

Brand Name: DUXPCB
Model Number: Aluminum PCB
MOQ: 1 pcs
Price: 3–5 days for prototype, 7–10 days for mass production
Delivery Time: 3–5 days for prototype, 7–10 days for mass production
Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Detail Information
Place of Origin:
China
Certification:
UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH.
Name:
Metal Core PCB Fabrication
Packaging Details:
Vacuum + anti-static bag + foam + outer carton
Supply Ability:
30,000㎡/month
Highlight:

Metal Core PCB Fabrication Manufacturer

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Automotive Metal Core PCB Fabrication

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Aluminum PCB Manufacturers

Product Description
Aluminum PCB | 1-6 Layers 5W/M.K Thermal Conductivity | Automotive & Industrial Lighting | DuxPCB
Overview of Aluminum PCB

Aluminum PCBs, also known as Metal Core PCBs (MCPCB) or Thermal Clad PCBs, represent the pinnacle of thermal management for high-density power electronics. At DuxPCB, we engineer these substrates using a specialized three-layer architecture: a circuit copper layer, a thermally conductive but electrically isolating dielectric layer, and a high-grade aluminum base (typically 5052 or 6061 alloys). Our manufacturing process focuses on optimizing the interface resistance between these layers to ensure rapid heat dissipation, vital for high-performance LED arrays, power converters, and motor drives where conventional FR-4 fails due to thermal saturation.

Advanced Thermal Substrates and Hybrid Stackups

In addition to standard single-sided configurations, DuxPCB leads the industry in Hybrid Aluminum PCB and Multilayer Metal Core designs. We integrate specialized dielectric materials like TCB-4 and JQG05 to achieve thermal conductivities up to 5W/m.K. Our hybrid stackups allow engineers to combine the thermal benefits of aluminum with the high-frequency performance of Rogers or Megtron materials. This is critical for Class 3 aerospace and defense applications where thermal stability and signal integrity are non-negotiable. Our capabilities include complex blind and buried vias within the aluminum substrate to maximize routing density while maintaining structural integrity.

Technical Capability Table
Thermal Properties Aluminum 5052 Aluminum 6061
Melting Point Range (℃) 605/650 582/652
Linear Expansion 10-6k-1 (20-100℃) 23.8 23.6
Specific Heat Capacity J/kg-K (0/100℃) 900 896
Heat Conductivity W/m-k (20℃) 138 167
Brand Model Thermal Conductivity
BOYU AL-01-B10 1W/M.K
BOYU AL-01-B20 2W/M.K
BOYU AL-01-B30 3W/M.K
TCB-4 4W/M.K
JQ133 2W/M.K
JQG05 5W/M.K
Drill & Outline Specifications Item Parameter
Machine Drill Hole Size 1.0-6.4mm Minimum Routing Bit: 1.0mm
Insulation Hole 0.5-6.4mm Outline Tolerance: ±0.13mm (Min ±0.10mm)
NPTH to Copper Space 0.20mm Outline Location Tolerance: ±0.10mm
Hole Location Tolerance ±3mil Copper to Milling (Avoid Exposure): 0.20mm
V-CUT Angle & Thickness 30° (±5°) PCB Thickness for V-CUT: 0.6-3.0mm
Aluminum PCB Capabilities Technical Standards
Layer Count 1-6 Layers
Aluminum PCB Types Single-sided, Double-sided, Multilayer, Hybrid, Flexible, High-Frequency
Quality Level IPC-A-600 Class 3/2
Substrate Thickness 0.6-5.0mm (Tolerance ≤1.0mm: +/-0.10mm)
Trace Width/Space 1OZ: 6/6mil | 2OZ: 8/8mil | 3OZ: 12/12mil
Copper Weight 1OZ to 8OZ (35μm to 280μm)
Surface Finish ENIG, OSP, HASL, Immersion Silver, Immersion Gold
Certifications IATF 16949:2016, ISO 9001, ISO 14001, ISO 13485, UL
Why Partner with DuxPCB?
  • 1. Solving manufacturing failures in complex designs: We specialize in high-difficulty metal core projects that local shops or low-cost offshore vendors reject due to precision requirements or heavy copper weights.
  • 2. Precision impedance and signal integrity control: DuxPCB maintains tight tolerances on dielectric thickness and trace geometry where competitors drift, ensuring consistent performance in RF and high-speed power applications.
  • 3. Mastery of exotic materials: Our expertise with Rogers, Megtron, and Arlon, combined with aluminum bases, ensures zero-delamination even in the harshest thermal cycling environments.
  • 4. Advanced DFM engineering: Our senior engineers perform rigorous Design for Manufacturing checks to catch layout errors, such as insufficient copper-to-edge clearance or incorrect V-cut alignments, before they result in production scrap.
Engineering FAQs

Q: What is the maximum breakdown voltage for your aluminum PCB dielectrics?
A: Depending on the material choice (e.g., TCB-4 or JQG05), we can achieve breakdown voltages exceeding 3000V AC, which is critical for industrial power supply and automotive inverter applications.

Q: Can DuxPCB handle heavy copper up to 8OZ on an aluminum base?
A: Yes. We are equipped for heavy copper processing, ensuring proper etching profiles and solder mask coverage for high-current paths in industrial motor controllers.

Q: Do you offer high-reflectivity solder masks for LED applications?
A: Absolutely. We utilize Taiyo PSR-4000 series (WT03/LEW3) to provide maximum light reflectivity and UV resistance for high-output lighting systems.

For complex stackup consultations or to secure Class 3 manufacturing for your mission-critical project, please upload your Gerber files or contact our engineering team directly for a comprehensive technical review.