Prototype PCB Assembly 64 Layers Rigid Flex Prototype Printed Circuit Board Assembly Service

Prototype PCB assembly is the high-stakes bridge between electronic design and functional hardware. At DuxPCB, we specialize in high-complexity prototypes that demand IPC Class 3 precision and rapid iteration cycles. Unlike standard assembly houses, our facility is optimized for high-mix, low-volume designs featuring high-density interconnects (HDI), fine-pitch BGAs (down to 0.25mm), and complex hybrid stackups. We integrate advanced SMT lines with rigorous Design for Manufacturability (DFM) reviews to ensure your most ambitious engineering concepts transition seamlessly to reality without the typical delays of assembly-stage failures.

For high-performance systems in aerospace and telecommunications, thermal stability and signal integrity are paramount. Our assembly process incorporates specialized techniques for handling heavy copper boards, thermal vias, and micro-vias. We provide integrated signal integrity analysis and impedance verification using Polar Instruments Si8000, ensuring that high-speed differential pairs maintain their target impedance throughout the assembly cycle. Our expertise extends to managing complex heat dissipation requirements using specialized materials like Rogers and Megtron 6, preventing thermal throttling in high-frequency applications.

Reliability is non-negotiable in mission-critical industries. DuxPCB adheres to the most stringent global standards, including AS9100 for aerospace and ISO 13485 for medical devices. Our proprietary Manufacturing Execution System (MES) provides 100% component-level traceability, documenting the origin and processing history of every element on your board. To ensure zero-defect delivery, every prototype undergoes a comprehensive inspection suite, including 3D Automated Optical Inspection (AOI), 3D Solder Paste Inspection (SPI), and high-resolution 2D/3D X-Ray for hidden solder joints on BGA and QFN packages.

• 1. Solving manufacturing failures in complex designs: Many local shops and low-cost vendors reject designs with ultra-fine pitch components or complex via structures. DuxPCB thrives on high-difficulty boards, utilizing advanced pick-and-place precision to eliminate the assembly defects that lead to costly re-spins.
• 2. Precision impedance and signal integrity control: Competitors often suffer from impedance drift during the assembly and lamination cycles. We employ real-time monitoring and TDR testing to guarantee that your high-speed signals remain within ±5% tolerance, ensuring prototype performance matches simulation.
• 3. Mastery of exotic materials: Handling Rogers, Megtron, or Arlon requires specialized thermal profiles and moisture control. Our engineering team ensures zero-delamination and zero-warpage in harsh environments by strictly following material-specific lamination and soldering protocols.
• 4. Advanced DFM engineering: We don't just build; we audit. Our front-end engineers perform a deep-dive DFM and DFA analysis on every Gerber and BOM, catching layout errors, component footprint mismatches, and thermal bottlenecks before they become scrap.

• What certifications does DuxPCB hold for medical and aerospace prototypes? We are fully certified to ISO 9001, AS9100 (Aerospace), and ISO 13485 (Medical), with IPC-certified trainers on-site to ensure all workmanship meets Class 3 standards.
• Can you handle assembly for 0.25mm pitch BGA components? Yes, our high-precision SMT lines are equipped with 3D vision systems specifically calibrated for ultra-fine pitch BGA, QFN, and CSP components.
• Do you provide full turnkey services including component sourcing? We offer full turnkey, partial turnkey, and kitted options. Our global procurement network ensures component authenticity and traceability for all sourced parts.
• How do you verify the integrity of hidden solder joints? We use high-resolution 3D X-ray inspection to analyze solder bridges, voids, and wetting on BGA and leadless packages that are invisible to standard AOI.
• Can you assist with hybrid stackup design for prototypes? Our engineers specialize in hybrid builds, combining high-frequency Rogers layers with standard FR4 to optimize both performance and cost for your prototype.

Precision prototyping is only a click away. Upload your Gerber files and Bill of Materials (BOM) to our secure server for a comprehensive technical review and an engineering-grade quote within 24 hours.