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| Brand Name: | DUXPCB |
| Model Number: | Aerospace PCB |
| MOQ: | 1 pcs |
| Price: | 3–5 days for prototype, 7–10 days for mass production |
| Delivery Time: | 3–5 days for prototype, 7–10 days for mass production |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
Aerospace PCBs represent the pinnacle of high-reliability interconnect technology, engineered to survive the most hostile environments known to man. Unlike standard industrial boards, Aerospace PCBs must maintain electrical and mechanical integrity under extreme thermal cycling (-55°C to +125°C), high-frequency vibration, and ionizing radiation. At DuxPCB, we specialize in IPC Class 3 and 3A fabrication, ensuring zero-fail performance for avionics, satellite communications, and flight control systems. Our manufacturing processes are aligned with MIL-PRF-31032 standards, utilizing High-Density Interconnect (HDI) structures and advanced materials to meet the stringent weight and size constraints of modern aerospace engineering.
Thermal regulation is critical in vacuum environments where convection cooling is absent. DuxPCB employs advanced thermal management strategies, including the integration of heavy copper layers (up to 10oz), metal cores, and thermally conductive dielectric materials. To prevent delamination during rapid temperature shifts, we utilize high-Tg polyimide and specialized laminates from Arlon and Rogers. Our processes include vacuum-rated outgassing control and plasma etching to ensure maximum adhesion of plated-through holes, providing a robust foundation for mission-critical systems that cannot be repaired once deployed.
Modern defense and aerospace applications require a blend of high-speed digital processing and RF/microwave capabilities. We excel in hybrid stackup construction, combining high-frequency materials like Rogers 4350B or Megtron 6 with ultra-stable polyimide cores. This approach allows for precise controlled impedance (within ±5%) while maintaining the mechanical rigidity required for high-vibration environments. By utilizing stacked and staggered microvias, we enable fine-pitch BGA routing and signal paths that support frequencies exceeding 20 GHz, ensuring impeccable signal integrity for radar and secure communication platforms.
| Feature | Specification / Capability |
|---|---|
| Layer Count | 2 to 48 Layers |
| Material Mastery | Polyimide (Arlon 85N), Rogers 3000/4000, Megtron 6/7, Isola Tachyon |
| IPC Classification | IPC-6012 Class 3 / 3A (Aviation & Defense) |
| Minimum Trace / Space | 2.5 mil / 2.5 mil (63.5 μm) |
| Microvia Technology | Laser Drilled (0.1mm), Stacked, Staggered, ELIC |
| Copper Weight | 0.5 oz to 10 oz (Heavy Copper Support) |
| Aspect Ratio | 12:1 (Plated Through Hole) |
| Surface Finishes | ENEPIG, ENIG, Lead-free HASL, Hard Gold, Immersion Silver |
| Impedance Control | ±5% Tolerance (TDR Tested) |
While Class 3 covers high-reliability electronics where downtime is not acceptable, Class 3A (governed by IPC-6012DS) is specifically for the military and aerospace sector, requiring even tighter tolerances on annular rings and internal plating to ensure survival under extreme flight stresses.
We follow NASA-standard outgassing requirements by using low-outgassing materials and ensuring a rigorous baking process post-fabrication. This prevents the release of volatile compounds that could contaminate sensitive optical equipment in a vacuum.
Yes. We frequently build hybrid stackups to balance cost and performance. This involves complex bonding cycles to ensure different material expansion rates (CTE) do not cause board warping or via fractures.
For mission-critical Aerospace PCB projects, precision is the only option. Contact the DuxPCB engineering team today to review your stackup or upload your Gerber files for a comprehensive technical assessment.
