SI / PI EMC Analysis Services For High Speed Electronics ROHS Certified

In the era of Gigabit speeds and shrinking voltage margins, "Rule of Thumb" design is no longer sufficient. A PCB is no longer just a carrier for components; it is a complex component itself, behaving as a transmission line system.

At DuxPCB, we close the gap between design and reality. Our Signal Integrity (SI), Power Integrity (PI), and EMC analysis services leverage advanced simulation tools to predict and prevent failures before fabrication. We help you eliminate costly prototype iterations (respins) caused by signal degradation, voltage droop, or EMI compliance failures.

Guaranteeing Data Reliability at Speed.

As data rates climb above 1Gbps, traces act as transmission lines susceptible to physics-based distortions. Our Engineering Team simulates the entire channel to ensure your high-speed interfaces perform within spec.

• Channel Topology Simulation: We analyze reflections, ringing, and overshoot/undershoot caused by impedance discontinuities.

• Crosstalk Analysis (NEXT/FEXT): Identifying aggressive coupling between high-speed differential pairs and sensitive analog lines.

• Timing & Jitter Analysis: Verifying setup/hold times and clock skew to ensure data latching reliability.

• Eye Diagram Verification: We simulate the "Eye" opening to predict Bit Error Rates (BER) for high-speed protocols.

We specialize in optimizing layouts for critical standards:

• Memory: DDR3, DDR4, DDR5, LPDDR.

• SerDes: PCIe Gen 3/4/5, USB 3.x/4.0, SATA, HDMI 2.1.

• Networking: 10G / 25G / 100G Ethernet.

Stable Power for High-Performance Chips.

Modern FPGAs and CPUs require high currents at low voltages with tight tolerances. A poor Power Distribution Network (PDN) leads to logic errors and intermittent resets. We optimize your PDN to ensure clean power delivery.

• DC Drop (IR Drop) Analysis: We simulate current density across power planes to identify bottlenecks (choke points) that cause excessive voltage drop or overheating.

• Decoupling Capacitor Strategy: We determine the optimal number, value, and placement of decoupling capacitors to maintain low target impedance across the frequency spectrum.

• Plane Resonance Analysis: Identifying and dampening cavity resonances between power and ground planes that can act as EMI antennas.

Pass Certification on the First Try.

Failing FCC/CE/UL certification is a hardware startup's nightmare. It means delays and expensive re-designs. DuxPCB provides Pre-Compliance Simulation to identify radiation risks early.

• EMI Radiation Simulation: We identify high-current loops and noisy traces that are likely to radiate electromagnetic interference.

• Shielding & Filtering: We recommend shielding cans, ferrite beads, and common-mode chokes at critical I/O interfaces.

• Stack-up Optimization for EMC: Adjusting layer arrangements to maximize ground coupling and shield noisy internal layers.

We invest in industry-leading simulation software to provide laboratory-grade accuracy.

Most PCB manufacturers will simply build what you send them—even if it is destined to fail. DuxPCB is different.

• 100+ Engineers: Our team understands the physics behind the layout. We don't just run software; we interpret the data and propose actionable fixes.

• Material Science: We recommend the exact substrate (Rogers, Megtron, Isola) required to meet your loss-tangent (Df) requirements, balancing performance and cost.

• Integrated DFM: We ensure that the SI/PI optimizations (e.g., back-drilling, via-in-pad) are actually manufacturable at high yield.

Don't leave your signal quality to chance.
Partner with DuxPCB for a comprehensive engineering review.