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| Brand Name: | DuxPCB |
| Model Number: | Flexible PCB |
| MOQ: | 1 pcs |
| Price: | 3–5 days for prototype, 7–10 days for mass production |
| Delivery Time: | 3–5 days for prototype, 7–10 days for mass production |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
DuxPCB is a premier provider of Flexible Printed Circuits (FPC) and Rigid-Flex PCBs. From prototype validation to high-volume mass production, we deliver interconnect solutions that solve complex space, weight, and reliability challenges for the automotive, medical, industrial, and consumer electronics sectors.
We do not just manufacture boards; we engineer reliability. By combining advanced material science with precision manufacturing, DuxPCB ensures your flexible circuits perform flawlessly in the most demanding environments.
DuxPCB continuously invests in advanced equipment to push the boundaries of FPC manufacturing. Check our fabrication limits below to see if your design fits our process.
| Capability Item | Standard Specification | Advanced Specification |
|---|---|---|
| Layer Count | 1 - 6 Layers | Up to 10 Layers (Rigid-Flex up to 20L) |
| Base Material | Polyimide (PI), Polyester (PET) | Adhesiveless PI (DuPont/Panasonic) |
| Board Thickness | 0.08mm - 0.40mm | 0.05mm (Ultra-thin) |
| Copper Weight | 0.5oz - 1oz | 1/3oz (12um) - 3oz (105um) |
| Min. Trace / Space | 4mil / 4mil (0.10mm) | 3mil / 3mil (0.075mm) |
| Min. Mechanical Drill | 0.20mm | 0.15mm |
| Min. Laser Drill | 0.10mm | 0.075mm |
| Surface Finish | ENIG, OSP, Immersion Tin | Immersion Silver, Hard Gold, ENEPIG |
| Coverlay Alignment | +/- 0.10mm | +/- 0.05mm (LDI Technology) |
| Impedance Control | Single Ended / Differential | +/- 10% Tolerance |
We offer a comprehensive range of FPC structures to meet specific design requirements.
The most basic structure, consisting of a single layer of copper bonded between a Polyimide base and a Coverlay.
Application: Dynamic hinge connectors, simple keypad matrices, LED strips.
Feature: Highest flexibility and lowest cost.
Two conductive copper layers with plated through-holes (PTH) connecting them.
Application: Complex signal routing, ground plane shielding, impedance-controlled designs.
Feature: Balances density with flexibility.
Three or more layers of copper. Due to the thickness, flexibility decreases significantly.
Application: High-density military cables, complex sensor arrays.
Feature: Used primarily for static (flex-to-install) applications rather than dynamic flexing.
A hybrid construction integrating standard rigid FR4 layers with flexible PI layers. The flexible tail extends from the rigid section, eliminating the need for connectors.
Application: Aerospace avionics, high-end medical devices, cameras.
Feature: The ultimate solution for reliability and miniaturization, reducing assembly points.
Flexible PCBs often require rigid support in specific areas to support components or facilitate connection. Stiffeners are not electrically functional but are mechanically critical.
| Stiffener Type | Description & Usage |
|---|---|
| Polyimide (PI) | Used to thicken the board at contact fingers (ZIF connectors) to meet insertion thickness requirements (e.g., 0.3mm). |
| FR4 | Provides a rigid flat surface under ICs, BGAs, or heavy components to prevent solder joint cracking. |
| Stainless Steel | Ultra-thin and rigid. Used when space is tight or for providing a tactile feel under membrane buttons. |
| Aluminum | Used primarily for heat dissipation in high-power LED or power supply applications. |
Designers switch from rigid boards to flex circuits to save up to 60% of weight and 75% of space. This technology is critical for:
Medical: Ultrasound probes, hearing aids, pacemakers, and minimally invasive sensors.
Automotive: LED lighting modules, battery management systems (BMS), and infotainment connections.
Industrial: Robotics arms, barcode scanners, and heavy-duty sensors.
Consumer: Smartphones, cameras, wearables, and LCD displays.
Manufacturing flexible circuits requires a completely different mindset compared to rigid boards. The materials shrink, the adhesives flow, and the dimensional stability is volatile. Here is how we control the risks:
1. Material Expertise
We partner with top-tier material suppliers including DuPont Pyralux, Panasonic, and Shengyi. We offer both adhesive-based and adhesiveless copper clad laminates (FCCL). Adhesiveless materials are standard for our high-reliability projects, offering thinner profiles and better thermal performance.
2. Precision Tooling Strategy
Laser Cutting: We use UV lasers for prototypes and quick-turn batches, eliminating tooling costs.
Hard Steel Dies: For mass production, we utilize high-precision steel molds to ensure the outline tolerance is within +/- 0.05mm, ensuring smooth assembly.
3. Specialized Assembly (PCBA)
Mounting components on a flexible surface is challenging. DuxPCB employs magnetic fixtures and specialized baking protocols to eliminate moisture before reflow. This prevents delamination (the "popcorn effect") and ensures excellent coplanarity for fine-pitch components like BGAs and QFNs.
We do not compromise on quality. Every flexible circuit undergoes rigorous inspection.
Electrical E-Test: 100% Open/Short testing using Flying Probe or Fixture.
AOI (Automated Optical Inspection): Scanning inner and outer layers for etching defects.
Flexural Endurance Test: Simulating the product lifecycle to ensure copper does not fracture under bending.
Peel Strength Test: Verifying the bond strength between the copper and polyimide.
Impedance Testing: TDR verification for high-speed signal integrity.
Don't let fabrication limitations hold back your product design. Whether you are building a simple flex connector or a complex multi-layer rigid-flex board, DuxPCB has the expertise to bring it to life.
Contact our engineering team today for a free design consultation and comprehensive quotation.
