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| Brand Name: | DUXPCB |
| Model Number: | PCB Assembly Functional Testing |
| MOQ: | 1 pcs |
| Price: | Negotiable (depends on BOM) |
| Delivery Time: | 3–5 days for prototype, 7–10 days for mass production |
| Payment Terms: | MoneyGram,Western Union,T/T,D/P,D/A,L/C |
DuxPCB provides advanced PCB Assembly Functional Testing (FCT) designed for mission-critical electronics where failure is not an option. Our technical approach focuses on verifying the complete operational logic of high-density interconnect (HDI) assemblies, ensuring that complex signal paths and fine-pitch component interactions meet IPC Class 3 standards. By simulating real-world electrical environments, we validate controlled impedance, power distribution networks, and high-speed communication interfaces before delivery.
Beyond standard electrical verification, our functional protocols include Environmental Stress Screening (ESS). We simulate harsh operating conditions for aerospace and industrial applications, including temperature cycling, humidity stress, and vibration analysis. This ensures that solder joint integrity and material stability—particularly in exotic substrates like Rogers or Megtron—remain robust under thermal expansion and mechanical shock, preventing field failures in extreme environments.
DuxPCB specializes in the development of custom test fixtures and automated test equipment (ATE) tailored to specific industrial protocols. Our engineering team manages firmware flashing for MCUs, FPGAs, and EEPROMs, followed by rigorous communication verification (I2C, SPI, CAN, Ethernet). This integrated approach allows us to detect subtle logic errors or timing issues in fine-pitch BGA and CSP components that standard visual or optical inspections might bypass.
| Inspection & Test Step | Technical Specification & Requirement |
|---|---|
| Visual Inspection after SMT Process | Microscopic verification of component alignment and solder fillet quality for fine-pitch devices. |
| Automated Optical Inspection (AOI) | High-resolution 3D AOI provided free of charge to detect missing components, polarity issues, and bridging. |
| X-Ray Inspection (Optional) | Non-destructive inspection for BGA, QFN, and hidden solder joints to ensure zero-voiding and proper wetting. |
| In-Circuit Testing (ICT) | Component-level verification using bed-of-nails or flying probe to check for shorts, opens, and passive values. |
| Functional Testing (FCT) | Full system-level simulation with custom software to verify signal integrity and operational logic. |
| Final Visual and Quality Inspection | End-to-end audit ensuring compliance with IPC-A-610 Class 3 and customer-specific documentation. |
Q: What is the difference between ICT and FCT in your process?
A: ICT checks individual components and circuit continuity at the hardware level, while FCT validates the entire assembly's performance by powering it up and running specific software or firmware protocols.
Q: Do you support testing for IPC Class 3 medical devices?
A: Yes, DuxPCB is optimized for high-reliability sectors, providing the documentation and testing rigor required for Class 3 medical, aerospace, and defense electronics.
Q: Can DuxPCB develop custom test fixtures for my project?
A: Absolutely. Our technical engineers design custom jigs and programming interfaces based on your Gerber files and functional specifications to ensure 100% test coverage.
Q: How do you handle fine-pitch BGA inspection?
A: We utilize advanced 3D X-Ray inspection alongside functional boundary scans to ensure that every hidden connection under fine-pitch BGA packages is perfectly soldered and electrically sound.
For a comprehensive technical review of your design or to receive a quote for IPC Class 3 assembly with full functional testing, please upload your Gerber files and test requirements directly to our engineering portal.
