Industrial Control PCB Assembly , Electronic Circuit Board Assembly Service

DuxPCB delivers high-reliability PCBA solutions tailored specifically for the industrial automation, robotics, power grid, and transportation sectors.

In the industrial world, the cost of failure is not measured in the price of the board, but in the downtime of the entire production line. We understand that industrial control boards must withstand conditions that would destroy consumer electronics: extreme temperature cycling, continuous vibration, high humidity, electromagnetic interference (EMI), and voltage surges.

We don't just assemble components; we engineer longevity. From automated selective conformal coating to component obsolescence management, DuxPCB ensures your PLCs, HMIs, and Motor Drives deliver stable performance for their entire 10+ year operational lifecycle.

Industrial electronics face specific failure modes. DuxPCB has optimized its manufacturing process to counteract these threats directly.

Industrial machinery vibrates constantly. Standard solder joints can develop fatigue cracks over time.

• Solution: We apply staking compounds (Epoxy/Silicone) to large capacitors, inductors, and connectors to mechanically secure them to the PCB.

• Solution: We utilize Underfill technology for BGA components to reduce stress on solder balls during mechanical flexure.

High humidity and temperature changes can cause condensation. If the PCB is not perfectly clean, residual flux can lead to dendritic growth (short circuits) between traces.

• Solution: We employ an automated Inline Cleaning System using Zestron or Kyzen cleaning agents to remove all flux residues.

• Solution: We perform Ionic Contamination Testing (Rose Test) to ensure cleanliness levels meet IPC-TM-650 standards (< 1.56µg/cm² NaCl equivalent) before coating.

Power electronics generate significant heat.

• Solution: We are experts in Heavy Copper Assembly (up to 10oz) and Metal Core PCB (MCPCB) soldering for efficient heat dissipation.

• Solution: We perform X-Ray inspection on QFN thermal pads to ensure voiding is below 15%, guaranteeing maximum thermal transfer to the heatsink.

Our workflow follows a strict "Verify, Then Move" philosophy to ensure zero defects in complex industrial boards.

Step 1: Incoming Quality Control (IQC)

• Verification of component MPN and Date Codes.

• X-Ray counting for reels and moisture control (MSL management) baking for sensitive ICs.

Step 2: Solder Paste Printing

• Using 3D SPI (Solder Paste Inspection) machines to measure paste volume and height. This prevents 70% of soldering defects (like tombstoning or insufficient solder) before component placement.

Step 3: Automated Assembly (SMT & THT)

• High-speed Pick & Place for passives.

• High-precision mounters for large industrial connectors and BGAs.

• Selective Soldering machinery for Through-Hole components, ensuring consistent barrel fill without the thermal shock of wave soldering.

Step 4: Comprehensive Testing Strategy

• AOI (Automated Optical Inspection): 100% check for polarity, missing parts, and skew.

• ICT (In-Circuit Test): We build custom "Bed of Nails" fixtures to test individual component values and detect open/shorts.

• FCT (Functional Test): We simulate input voltages (e.g., 24V DC / 220V AC) and verify logic outputs, relays, and communication ports (RS485, CAN bus).

Step 5: Environmental Hardening

• Burn-In Testing: Running the boards under load in an aging chamber (typically 48 hours at elevated temperatures) to screen out "infant mortality" failures.

• Conformal Coating: Automated spray application of Acrylic, Silicone, or Polyurethane to waterproof the assembly.

Consumer products change every year; industrial machines run for decades. The biggest challenge for industrial OEMs is Component Obsolescence (EOL).

DuxPCB acts as your supply chain guardian:

1. BOM Health Check: We scrub your Bill of Materials against global databases to identify parts nearing End-of-Life status before you start production.

2. Strategic Stocking: We offer bonded inventory programs for critical, long-lead-time silicon (FPGAs, MCUs) to insulate you from market shortages.

3. Alternative Engineering: If a part becomes obsolete, our engineering team actively suggests form-fit-function replacements or redesigns the layout to accommodate available alternatives.

Our industrial portfolio is diverse, supporting critical infrastructure across the globe.

• Factory Automation: Programmable Logic Controllers (PLC), Variable Frequency Drives (VFD), Servo Amplifiers.

• Smart Energy: Solar Inverters, Wind Turbine Controllers, Smart Metering Gateways.

• Transportation: Railway Signaling Systems, EV Charging Stations, Fleet Telematics.

• Instrumentation: Industrial Weighing Scales, Gas Detectors, Flow Meters.

• HMI & Display: Ruggedized Touch Panels, Industrial PCs.

Q: Can you handle the assembly of Press-Fit connectors?
A: Yes, we utilize automated Press-Fit machines with force-monitoring to ensure connectors for backplanes and power modules are seated correctly without damaging the PCB through-holes.

Q: Do you support high-mix, low-volume orders for industrial machinery?
A: Absolutely. We specialize in High-Mix Low-Volume (HMLV). We have quick-changeover SMT lines specifically designed for batch sizes ranging from 50 to 5,000 units.

Q: How do you verify the quality of Conformal Coating?
A: We add a UV tracer to the coating material. After spraying, every board passes through a UV inspection station to visually verify coverage and ensure no coating has contaminated the connectors.

Q: Can you perform firmware programming for industrial MCUs?
A: Yes, we support online and offline programming for STM32, PIC, FPGA, and other industrial microcontrollers. We can also print and stick firmware version labels on the chips.

Don't let a cheap manufacturing process compromise your expensive machinery. Partner with an EMS provider who understands the rigor of industrial standards.

Send your Gerber files and BOM to DuxPCB. Our engineers will provide a comprehensive DFM review focused on reliability, manufacturability, and cost-efficiency.