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| Brand Name: | DUXPCB |
| Model Number: | Ceramic PCB |
| MOQ: | 1 pcs |
| Price: | 3–5 days for prototype, 7–10 days for mass production |
| Delivery Time: | 3–5 days for prototype, 7–10 days for mass production |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
Ceramic PCB | Al2O3 & AlN 1-8 Layers | Aerospace & Power Electronics | DuxPCB
Ceramic PCBs are the gold standard for high-performance electronics where traditional FR-4 and even Metal Core PCBs (MCPCB) fail to meet thermal and electrical insulation requirements. DuxPCB utilizes advanced ceramic substrates like Alumina (Al2O3) and Aluminum Nitride (AlN) to provide extreme thermal conductivity (up to 230W/m·K) and a Coefficient of Thermal Expansion (CTE) that closely matches silicon components. These boards are engineered for Class 3 reliability in aerospace, medical imaging, and high-power defense systems, offering fine pitch trace capabilities and exceptional high-frequency signal integrity through controlled impedance and ultra-low dielectric loss.
DuxPCB masters multiple metallization processes to suit specific mission-critical applications. Direct Bonded Copper (DBC) is utilized for heavy power modules requiring high current-carrying capacity, while Direct Plated Copper (DPC) is the preferred choice for HDI designs requiring fine pitch traces as small as 0.01mm. For complex 3D structures and internal cavities, we provide LTCC (Low Temperature Co-fired Ceramic) and HTCC (High Temperature Co-fired Ceramic) solutions, ensuring robust performance under continuous operating temperatures exceeding 350°C.
In high-frequency telecom and radar applications, dielectric stability is paramount. Our Ceramic PCBs provide a stable Dielectric Constant (Dk) and ultra-low Dissipation Factor (Df), minimizing signal attenuation at GHz ranges. By combining laser-rapid activation with vacuum sputtering, we achieve superior adhesion between the copper and ceramic base, eliminating the risk of delamination in high-vibration aerospace environments or rapid thermal cycling in automotive power inverters.
| Feature | Ceramic PCB | Heavy Copper PCB | Metal Core PCB |
|---|---|---|---|
| Base Material | Al2O3, AlN, BeO, SiC, BN | FR-4 (with thick copper) | Aluminum, Copper, Iron |
| Thermal Conductivity | Highest | High | High |
| Electrical Insulation | Excellent | Good | Good |
| Current Carrying Capacity | Relatively low | Highest | Moderate |
| Hardness | High hardness, brittle | High hardness, corrosion-resistant | High hardness |
| Weight | Relatively low | Heaviest | Light (Al) or Heavy (Cu) |
| Cost | High (expensive) | Moderate | Low (Al) or High (Cu) |
| PROPERTY | ITEMS | Unit | Al2O3 96% | AlN |
|---|---|---|---|---|
| Physical | Color | - | White | Grey |
| Physical | Water absorption | % | 0 | 0 |
| Physical | Reflectivity | % | 94(1mm) | 30(0.5mm) |
| Electrical | Dielectric Constant (1MHz) | - | 9~10 | 8~10 |
| Electrical | Dielectric Loss | *10^-4 | 3 | 3 |
| Electrical | Dielectric Strength | MV/m | >15 | >17 |
| Electrical | Insulation/Volume resistance | Ω·cm | >10^14 | >10^14 |
| Mechanical | Density after Sintering | g/cm3 | >3.7 | 3.26 |
| Mechanical | Flexural Strength | Mpa | >400 | ~380 |
| Mechanical | Surface Roughness | μm | 0.2~0.75 | 0.3~0.6 |
| Mechanical | Camber | Length% | ≤2 | ≤2 |
| Thermal | CTE (RT~500°C) | ppm/°C | 6.5-8.0 | 2.5~3.5 |
| Thermal | Thermal Conductivity (25°C) | W/m·K | 24 | 170 |
| Specifications | Capabilities |
|---|---|
| Layers | 1-8 Layer |
| Solder Mask | Black, Green, Red, Yellow, White, Blue |
| Thermal Conductivity | 24-170W/K.M (Up to 230 for custom AlN) |
| Thicker Copper | 1/3OZ - 12OZ |
| Finished Board Thickness | 0.4mm - 5mm |
| Panel Sizes | Max 170 x 250mm (Usable 160 x 240mm) |
| Aspect Ratio | 8/1 |
| Minimum Line Width/Spacing | 0.01mm (DPC Technology) |
| Trace width/space (DBC) | 150μm to 300μm |
| Trace width/space (Plating) | 1OZ: 0.1mm / 3OZ: 0.3mm / 9OZ: 0.6mm |
| Finished Surface | Immersion Silver, Immersion Gold, ENEPIG |
| Technology | Thick/Thin film, DBC, DPC(3D), LAM, LTCC, HTCC |
| Laser drill | ≥60μm |
| Rules | DFM, DFA, IPC Class 3 |
A: Ceramic substrates like Aluminum Nitride have a CTE of 3.5-4.5 ppm/°C, which closely matches Silicon (CTE ~3 ppm/°C). This prevents solder joint fatigue and component cracking during thermal cycling in high-power semiconductor applications.
A: Thick Film uses screen printing and sintering of pastes (traces >100μm), while DPC (Direct Plated Copper) uses semi-conductor manufacturing processes (sputtering and plating) to achieve fine pitch traces down to 10μm with higher circuit density.
A: Yes, ceramics offer superior dielectric strength (>15 KV/mm), making them ideal for high-voltage power inverters and medical X-ray equipment where electrical isolation is a safety-critical requirement.
A: We utilize laser-drilled blind and buried vias and precision etching to maintain 50-ohm impedance matching. Our Al2O3 and AlN substrates exhibit extremely low loss tangents, making them superior for RF and microwave frequency bands.
DuxPCB is ready to support your next high-performance mission. Upload your Gerber files today for a comprehensive DFM review and technical quote from our senior engineering team.
